SMT/BGA rework system provides HD vision

Superimposed views of component leads and PCB solder pads are provided by joystick-controlled zoom, with 230x magnification and high-brightness LED lighting. This allows for easy alignment using ultra-fine X, Y, and Θ axis micrometres. Featuring a high-precision Z-axis drive mechanism and automatic height sensing, the system provides the ±0.01mm placement accuracy needed for 0.3 mm (0.012") lead pitch µBGAs and delicate QFPs.

Heater nozzles, which are available in sizes from 2x2 to 55x55mm, direct up to 1200W of hot air from the upper heater to the component. To prevent chip components from shifting during reflow, the RW1200 features adjustable hot air flow control. The 1200W bottom heater is surrounded by a 2700W, rapid IR underheater that quickly heats the bottom surface of the PCB. This prevents board warpage, reduces cycle times and limits temperature exposure.

Set temperature versus actual temperature profiles measured through the unit’s built-in thermocouple input can be recorded and exported to a flash drive connected to a USB port on the front of the machine.

The RW1200 is fully-equipped for less than $15,000. For a limited time, Manncorp is offering free, on-site installation and training on the SMT/BGA rework system, which is provided with a full two-year parts warranty and unlimited factory support.