Photo Stencil's NiCut Stencil Now Available in Step Stencil Configuration

NiCut stencils give excellent results for fine pitch components including BGAs, QFNs, and resistor networks. In the NiCut step stencil, the squeegee side steps are grown using the electroform process, for example a stencil that is 5 mil thick with a step-down to 3 mils in some areas, a step-down to 4 mils in some areas, and a step-up to 7 mils in some areas. For this stencil the electroform process is straight-forward. The stencil is plated up to 3 mils, the 3 mil area is blocked off with resist and the plating continues to 4 mils, the 4 mil area is blocked off with resist, the plating continues to 5 mils, then this area is blocked off with resist leaving only the 7 mil area exposed for continued plating. The stencil is removed from the electroforming mandrel. All apertures are then cut into the stencil foil. Any relief pockets that are required are chem-etched on the contact side prior to laser cutting.

"Extensive print studies have demonstrated that NiCut stencils have paste transfer efficiencies better than normal laser-cut stencils and just below electroform stencils," explained Rachel Miller-Short, global VP of sales, Photo Stencil. "Step stencils are ideal for applications with high density and mixed components. Being able to offer our customers step stencils using our NiCut technology gives them the best option when they need a very high quality stencil and time is of the essence."