Mühlbauer presents its 'Reel to Reel Flip Chip LED'

The integrative process is based on a wafer-level packaging approach and consists of three basic steps: the bonding of LEDs (and other components like diodes, power control components and connectors); the dispensing of the lenses or phosphors; and the final test.

In general, the 'Reel to Reel Flip Chip LED' has several advantages over the current conventional technologies on the market. In the first place and most important, it saves up to 30% on the LED production costs. The cost savings are due to the now redundant gold wires, as well as to the significantly lower investment required by the production equipment.

In the second place, the production process is faster and easier to handle. With up to 20,000 units per hour the systems are achieving significantly higher production speeds. Due to the Reel to Reel procedure, a lot of the current subassembly steps can be omitted. The introduced technology is based on Flip Chip Reel to Reel, which has already been proven in Mühlbauer’s RFID division and is now adapted to LED applications according to customer requirements. In the RFID market, which is entering the high-volume phase right now, the leading topics are highest yield in combination with materials at competitive costs, thereby reflecting a similar situation to the LED market.