Latest trends in PCB technologies

On the second day AT&S offers individualized company forums with its experts at the Santa Clara Hyatt Regency Hotel. Hosted by Scott Clifford, President AT&S Americas, the presentations will start with an overview of the technology drivers impacting the next generation of PCB technology.

Hannes Voraberger, Group Manager AT&S R&D will describe how PCB and substrate technologies will merge providing continued miniaturization. This technology oriented presentation will be followed by an industry outlook analyzing the key market trends driving interconnect technology, given by Prismark Partners, an electronics industry consulting firm. A customer perspective explaining the 3D system supply chain integration will be presented by the UTAC Group.

Other speakers will address the design for embedded technology with focus on thinner formats and higher integration as well as mobile design considerations like performance, density, cycle time and material. In addition, PCB flex & rigid technologies and applications, power electronics and thermal management options, mechanical integration and 3D technologies, high-speed and high-frequency in PCB manufacturing are being addressed by the experts.