KIC’s MB Allen to present at SMTA Carolinas

Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.

Marybeth Allen is the Product Manager for KIC and, as such she coordinates the advancement of new products and features to accommodate customer needs as KIC adds to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company's product offerings. MB has worked in the electronics industry for nearly 30 years and been associated with KIC for 26 years with both national and international positions.