IPC crowns hand solder champ at SMT Hybrid Packaging 2016
A record 43 competitors competed at IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2016 in Nuremberg, Germany. Taking first place was Ekatarina Stahlmann of Grundig Business Syst., who earned 495 points out of 506.
Second place went to Eliane Chesnais of Thales International while Sandra Klinger, SüdWest-Elektronik, took third place.
Participants in the hand soldering competition were tasked with building a functional electronics assembly within a 60-minute time limit. Master Instructor Trainers Rob and Stefan Walls, PIEK, served as independent judges and evaluated each assembly based on workmanship, overall functionality, compliance with IPC-A-610 Class 3 criteria and speed to complete the PCB.
“The best-of-the-best hand soldering talent in Europe came to compete at this event,” said David Bergman, IPC vice president of international relations. “The competition was tough, but each competitor rose to the challenge. We look forward to hosting more hand soldering competition across the globe.”
Bergman added, “IPC would like to thank hand soldering competition gold sponsors: JBC, Kurtz Ersa, and Weller; silver sponsors: Almit, Balver Zinn, and Elmatica; bronze sponsor: Optilia and Piek; and contest contributors: IFTEC and Mircosolder for their support.”
IPC is planning to hold another hand soldering competition later this year in Europe.
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