Guide focuses on thermal interface material dispensing

Within the publication Chomerics engineers provide detailed information about the company’s range of THERM-A-GAP gels, THERM-A-FORM cure-in-place compounds and other dispensable thermal interface materials. Comprehensive advice and guidance on dispensing equipment types for either low or high volume applications helps steer customers to the most appropriate method and system for their specific application.

Parker Chomerics’ thermally conductive dispensable products are ideal solutions for today’s electronic packages. Thermally conductive dispensable materials have the ability to cover a variety of gaps and conform to complex geometries. This ability to conform provides the required closure force and contact resistance, resulting in lower component temperature and improved MTBF (mean time between failure).

When using dispensable products, factors such as pump equipment, mating surfaces, tolerance stack up, closure force, and physical application of the material have to be considered. There are many equipment options for the dispensing of thermal interface materials, ranging from manual syringes, to high volume automated dispensing systems. The choice of equipment will depend on several factors, including volume, labor/equipment cost, precision requirements, and material type to be dispensed.