Great cooling means perfect soldering results

This design incorporates an active cooling process, water-cooled using heat exchangers following an efficient 'closed loop' system. The process air is cooled in the heat exchangers and then flows onto the module from above. The air is subsequently sucked underneath, cleaned using a filter system and is then ready for the next cooling process. Individually adjustable ventilators in each of the zones make it possible to precisely control the cooling process and influence the cooling gradient accordingly. This makes it possible to cool the module to less than 50 °C in a stress-free manner, even in the case of lead-free soldering. It is easy to clean the cooling tract filters. They can be replaced from the back of the system. What's more, there is no need to open the process chamber at any point. In order to cool complex modules, an adjustable cooling system is required, which meets the demands of these electronic components. As well as our tried-and-tested cooling tract, we can also extend the cooling zones using a power cooling unit. As part of this process, cold air is fed onto the board from above, where it can be cooled in a more intensive, gentle manner as a result of the process being extended.

The power cooling unit can be implemented in the form of an extension to the standard cooling zones under nitrogen atmosphere and is also available as a separate, downstream module for increased cooling capacity for insensitive materials under normal atmospheric conditions. In the case of large or heavy modules, regular cooling power sometimes isn't enough to generate the desired outflow temperature. Bottom cooling makes it possible for the VisionXP+ to cool high-mass boards easily and effectively. The cold process air is blown onto the board in equal measures from above and below in order to facilitate a particularly homogeneous cooling process and to reduce tension in the material. It is possible to adjust the ventilator speeds for each module. This means additional cooling measures, such as an outfeed belt with ventilators, are unnecessary thanks to the low outlet temperatures. It is predominantly modules with inhomogeneous distribution of the copper positions that will be protected against twisting and warping as a result of bottom cooling.