Filler achieves a 20% increase in polymer thermal performance

“The performance improvements achieved are derived from the extremely high thermal conductivity of diamond, our ability to optimise the nanodiamond filler affinity to applied polymers and other thermal fillers and finally, Carbodeon’s improvements in nanodiamond filler agglomeration control,” said Vesa Myllymäki, CTO, Carbodeon. “With the ability to control all these parameters, the nanotechnology key paradigm of less gives more’ can truly be realised.”

Previously, the active surface chemistry inherent in detonation-synthesised nanodiamonds has presented difficulties in utilising the potential benefits of the 4-6nm particles, making them prone to agglomeration. Carbodeon optimises this surface chemistry so that the particles are driven to disperse and to become consistently integrated throughout parent materials, especially polymers. The much-promised properties of diamond can thus be imparted to other materials with very low concentrations.

For more demanding requirements, conductivity increases of as much as 100% can be achieved using 1.5% nanodiamond materials at 20% thermal filler loadings.

“This increase in thermal conductivity is achieved without affecting the electrical insulation or other mechanical properties of the material and with no or very low tool wear, making it an ideal choice for a wide range of electronics and LED applications,” said Myllymäki.

“We know we have not yet uncovered all the benefits that Carbodeon nanodiamonds can deliver and continue our focused application development on both polymer thermal compounds, and on metal finishing and industrial polymer coatings,” Myllymäki added. “Recently we were granted a patent on nanodiamond-containing thermoplastic thermal composites and we see great future opportunities for these materials.”