Component Management

Highly viscous silicone-free paste prevents slumping

29th July 2015
Mick Elliott
0

The newly launched TCP091 silicone-free paste from Robnor Resins is now available from Ellsworth Adhesives Europe. The paste has been specially formulated to provide efficient and reliable heat transfer across the interface between electronic components. Developed to optimise performance, the paste is highly viscous, a property that helps prevent slumping.

Since the paste is silicone free, it dissipates without the migration or contamination that is commonly associated with silicone based products. Furthermore, it is easily applied with excellent flow and low separation in the syringe.

As a general purpose thermal management paste, TCP091 is a virtually "no-bleed", versatile compound that will not dry out, harden, melt, or run - even after long-term continuous exposure to temperatures up to 130°C.

TCP091 is REACH and ROSH compliant and is available in 10ml & 30ml syringes and 1kg & 25kg bulk containers.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier