Component Management

Dispensable material boosts thermal performance

24th February 2014
Nat Bowers
0

The company’s latest and highest performing dispensable thermal interface material, the Gap Filler 4000 has been announced by Bergquist. Enabling greater flexibility in dispensing and assembly processes, Bergquist claim that this delivers best-in-class thermal conductivity of 4.0W/m-K and extended working time of up to four hours.

Suitable for filling unique and intricate air voids and gaps, Gap Filler 4000 is a two-part liquid material with shear thinning characteristics for optimum dispensing. It displays excellent wetting with ultra conformability to minimise stress on components during assembly, remains in place after dispensing and maintains its shape on the target surface. With a low level of natural tack, this material is tended for applications where a strong structural bond is not required.

The dispensable thermal interface material has a cure time of 24 hours at room temperature or 30 minutes at 100°C. Unlike pre-formed gap fillers, these liquid dispensed materials offer infinite thickness options. Additionally, they eliminate the need for specific pad thicknesses or die-cut shapes for individual applications.

Bergquist’s Gap Filler family now offers eight formulations with thermal conductivity ranging between 1.0 and 4.0W/m-K. The, now extended, family includes two-part gap fillers with silicone-free formulae for silicone-sensitive applications and versions with very low outgassing for use where effects such as lens fogging may be a concern. The company can also offer one-part non-cure materials.

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