Assemblies offer copper & PCB circuitry benefits

The flexible circuitry, which supports larger connector housings and an array of surface-mounted electronic components, optimises the final product by allowing the assembly to be bent or folded into a 3D packaging space. Depending on the specific design requirements, the circuitry can be built with 20 or more layers. Increasing overall circuit density and providing additional packaging options, the circuits are surface mountable on one or both sides. Maximum flexibility for tight spaces is provided by unbonded layers. To reduce weight and optimise packaging in military devices, the flexible substrate integrates power and signal technologies into one package.

The Rigid Flex Circuits and Assemblies are suitable for a range of applications from hand-held to large storage and computing devices. To meet stringent military application requirements, the circuits and assemblies are available in a range of material stack-up and design layout options. The assemblies, which utilise many of Molex’s connectors, including Impact, NeoScale, SlimStack, can be press-fit, wave soldered or surface mounted.

“Rigid Flex Circuits and Assemblies enable seamless communications from land, sea and air,” said Dan Dawiedczyk, Director of Marketing, Molex. “Rigid Flex assemblies allow a unified approach to solve electronic power, signal distribution, and packaging problems when standard rigid boards or cables are not feasible. They can also help eliminate the need for separate boards, connectors and cables. Molex rigid flex assemblies provide a complete, lower applied-cost solution for high-end mission-critical power and signal distribution designs.”