Adhesive meets NASA low outgassing specs

11th January 2016

Peter Smith

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Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers which can be applied in bond lines as thin as 10-15 microns while offering an exceptionally low thermal resistance.

Heat transfer capabilities of this product are said to be outstanding while Supreme 18TC also passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries.

Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures. It bonds well to a wide variety of substrates including metals, composites, ceramics and plastics. This compound offers a tensile lap shear strength of 2,200-2,400 psi, a tensile strength of 6,000-7,000 psi, a t-peel strength of 5-10 pli and a compressive strength of 22,000-24,000 psi. Significantly, Supreme 18TC is a one part system that requires no mixing. Its working life is essentially “unlimited”. It requires heat curing for 60-90 minutes at 250-300°F. A post cure of a few hours at 350°F will optimize performance properties.

Supreme 18TC features a low shrinkage upon curing, a low CTE and a high degree of dimensional stability. This system is also a reliable electrical insulator. Supreme 18TC is designed to withstand thermal cycling and shock. It is serviceable over the wide temperature range of 4K to +400°F. This formulation is available for use in a variety of standard packaging options in sizes ranging from ounces to gallons.