Component Management

Global designer and manufacturer of thin sheet fastening devices and installation systems, PennEngineering, has introduced new PEM SMTSSS ReelFast SNAP-TOP standoff fasteners. The fasteners hold printed circuit boards securely in assemblies without requiring mating screws or other loose threaded hardware to complete attachment. These unthreaded standoffs promote streamlined production by easily installing in boards in the same manner an...

A pair of engineers at the University of Delaware has developed a process to form interwoven polymer networks more easily, quickly and sustainably than traditional methods allow. Their secret ingredient? Blue light. Abhishek Shete, graduate research assistant in materials science and engineering, and Christopher Kloxin, assistant professor in materials science and engineering and chemical and biomolecular engineering, describe their method i...

Scientists at the University of Chicago and Argonne National Laboratory have discovered a new way to precisely pattern nanomaterials that could open a new path to the next generation of everyday electronic devices. The new research, published in Science, is expected to make such materials easily available for eventual use in everything from LED displays to cellular phones to photodetectors and solar cells.

Washington State University physicists have found a way to write an electrical circuit into a crystal, opening up the possibility of transparent, 3D electronics that, like an Etch A Sketch, can be erased and reconfigured. The work, to appear in Scientific Reports, serves as a proof of concept for a phenomenon that WSU researchers first discovered by accident four years ago. At the time, a doctoral student found a 400-fold increase in th...

  Climate change is leading to ever higher temperatures and aridity in many areas, making efficient room cooling increasingly important. An ETH doctoral student at the Functional Materials Laboratory has developed an alternative to electrically powered air conditioning: a cooling curtain made of a porous triple-layer membrane.

Indium Corporation is to partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.

JBC has just announced what it describes as its smart Fume Extractor FAE for electronics soldering applications.  It is said to be capable of removing fumes safely and efficiently. The Fume Extractor FAE2-5A optimizes fume extraction operating only when needed. The FAE automatically starts working when the tool is in use. This function saves power and the life of the equipment as well as the filter.

An advanced electronics conformal coating formulated with a revolutionary new technology as an alternative to thin, solvent-based conformal coatings, the Dymax 9452-FC has been introduced from Intertronics. Whilst it has a very low viscosity – 20cP – it still provides good electrical insulation and protection against humidity, plus very good thermal shock and corrosion resistance.

As many of you know, providing an adequate thermally conductive interface between a component and its heatsink is essential to achieving long life and reliability. Traditionally, thermal greases have been the material of choice in this area, but new thermal phase change materials are now said to offer a stable alternative that is easier to apply. Thermal greases have relatively low thermal resistance and offer excellent thermal performance f...

Fujipoly's Sarcon PG25A is said to be one of the company’s softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates. When it is sandwiched between components of varying shapes and sizes and a nearby heat sink or spreader, this compliant 2.5 W/m°K material exhibits a thermal resistance as low as 0.42°Cin2/W at 14 PSI.