Component Management

Henkel’s LOCTITE 577 is a medium strength anaerobic adhesive for parallel/parallel and taper/parallel threads and fittings.  It is designed to lock and seal all metal pipes and fittings as well as other threaded assemblies, providing an instant, low pressure seal that will not creep, shrink or shred. Once fully cured LOCTITE 577 will provide a high pressure seal, resisting the burst pressure of the pipe in most instances.

Ellsworth Adhesives has announced the addition of  Dow Corning's EA-5151 adhesive to its product portfolio. This so called ‘Quick in Connect’ (QiC) adhesive has been formulated to accelerate electronic assembly and increase production throughput. Available as a one-part silicone formulation, Dow Corning EA-5151 is applied as a warmed liquid with a plunger-equipped gun or a robotic dispenser.

Anyone who has a rear-view mirror that automatically dims blue in reaction to annoying high-beam headlights glaring from behind has seen an electrochromic film in action. Now, chemists at the Georgia Institute of Technology have developed a new method to more safely and, by extension, easily produce these shear films, which change their colour with the help of a tiny electric current. This could make them available to many industries that ha...

Spiders’ silk is already tough stuff – just ask your friendly neighbourhood Spiderman. But now, researchers in Italy and the UK have found a way to make Spidey’s silk a lot stronger, using various different spider species and carbon nanotubes or graphene. The research team, led by Professor Nicola Pugno at the University of Trento, Italy, succeeded in having their spiders produce silk with up to three times the strengt...

Electrolube will be exhibiting and presenting at productronica India. According to the company, products taking centre stage at this year’s show include HFAC - a high performance and halogen-free acrylic conformal coating, HTCX-ZF – a zinc oxide-free thermal paste as well as a new range of high-performance resins specifically for LEDs.

Precision motion and positioning company, PI (Physik Instrumente), has introduced the L-402. The company now has a miniature linear stage in its range with a narrow size of only 22.5mm that makes it possible to easily integrate into even the most confined installation space. On top of that, the inexpensive precision stage can also move heavy loads up to 1kg smoothly and with a repeatability of up to 0.5μm. The maximum travel range is...

The QFN (quad flat pack, no leads) package can no longer be considered exotic. It was about a decade ago, but not any more. In fact, with the wafer scale BGA, it's one of the more common packages for new chip designs. Not all QFNs come with an exposed metal pad underneath, but most do, and that can still cause problems with reflow solder. The pad itself isn't the problem, but improper solder paste stencil layer design can be.

Master Bond has developed X21Med for priming and bonding polyolefinic substrates. It is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. According to Masterbond, this specialty system was designed to be used as a primer that would promote adhesion between polyolefins and other surfaces such as metals, ceramics, composites and other kinds of plastics. Surfaces primed with X21Med are compatible with a wide var...

The next generation of feature-filled and energy-efficient electronics will require computer chips just a few atoms thick. For all its positive attributes, trusty silicon can’t take us to these ultrathin extremes. Now, electrical engineers at Stanford have identified two semiconductors – hafnium diselenide and zirconium diselenide – that share or even exceed some of silicon’s desirable traits, starting with the fact t...

Electrolube will be hosting a presentation at productronica India’s Technical Automotive Seminar. Phil Kinner, Global Business and Technical Director of Electrolube’s Conformal Coatings Division, will present two automotive themed Conformal Coating case studies, examining real problems with an emphasis onanalysis and trouble shooting.