Component Management

Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behaviour, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and DELO Industrial Adhesives, covering more than 6 million dispensing cycles.

South Western US electronics and semiconductor manufacturers are set to benefit from an innovative range of electronics manufacturing consumables. Southwest Systems Technology will be representing Electrolube throughout its areas of operations, providing sales and support for a selected range of Electrolube’s electro-chemical products.

The cleaning experts at MicroCare will present their expanding range of innovative precision cleaning products at Southern Manufacturing & Electronics in Farnborough, Stand J145, from 5-7 February 2019. Tergo Metal Cleaning Fluid (MCF) will be showcased during the exhibition at MicroCare’s stand; J145.

Printing will be an enabler for mass customisation of electronics for the Internet of Things (IoT) and smart devices that will fuse form and function in new ways. This is according to Dr Janos Veres, who leads the Novel and Printed Electronics Program at PARC research centre in Silicon Valley. Dr Veres will be presenting a keynote session at this week’s Innovations in Large-Area Electronics 2019 conference (innoLAE2019) in Cambridge, which ...

An RFID system in which PCBs communicate with their SMT production line and contain all the relevant manufacturing data has been developed by HARTING. Based on the company’s RFID-4-SMT auto-ID solution, the new system cuts error rates, radically simplifies documentation requirements and forms the basis for automated PCB production in a batch size of one.

Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is suited for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.

Global supplier of electronic materials, Engineered Material Systems, for circuit assembly applications, has debuted its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.

When it comes to electrically conductive materials, we are dealing with dispersions. They are generally referred to as electrically conductive adhesives, silicones or inks. The materials are divided into different areas: Epoxy resins, polyurethanes, silicones and acrylates. Epoxy resins in particular stand out due to their processing and material properties.

Manufacturer of dispensing equipment solutions, Fisnar, has launched its next generation F4000 Advance Series of benchtop dispensing robots. This new robotics collection upgrades Fisnar’s existing F4000N range with enhanced product features and the addition of three completely new models, plus multiple size variations to accommodate customers’ diverse spectrum of dispensing requirements. 

A new webinar program has been published by DELO. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. Adhesive bonding is considered the joining technology of the 21st century and allows for light-weight construction, miniaturisation, and multi-material design.