Component Management

Electrolube has developed key thermal management and encapsulation resin products for battery protection including the thermal gap filler - GF400, non-silicone heat transfer compound HTCPX, - thermally conductive epoxy potting compound - ER2221, and soft polyurethane resin - UR5044.

In order to achieve good cleaning results consistently, the cleaner concentration in the cleaning bath should remain constant. The concentration can change through various process factors like carry-over or thinning. It is therefore advisable to check the concentration over time. A simple method for regular concentration checks is the ZESTRON Bath Analyzer. 

Victrex has launched VICTREX AM PEAK filament. The new offering has been specifically developed and optimised for additive manufacturing. The PEEK incumbent materials on the market today, although used in some AM applications, were designed for conventional manufacturing methods, such as machining and injection moulding.

A simple method for making clear coatings that can block heat and conduct electricity could radically cut the cost of energy-saving smart windows and heat-repelling glass. The spray-on clear coatings developed by researchers at RMIT University in Melbourne, Australia, are ultra-thin, cost-effective and rival the performance of current industry standards for transparent electrodes.

Manufacturer of cable management products, HellermannTyton, has extended its TipTag product range with the launch of its TipTag5 cable marker. Designed with size in mind, the small 5.5x50mm long tag can be used with the smallest wires and cables in the industry.

Anglia Components has strengthened its Anglia Inception offering with customised heatsinks which complement its wide range of standard thermal management solutions.

Dow has introduced the new DOWSIL VE-8001 Flexible Silicone Adhesive for flexible and foldable displays, smartphones, wearables, laptops, televisions and many other types of electronic devices.

Conformal coatings are very important if printed circuit boards are to operate reliably in harsh environments. Choosing the correct material for this process is carefully considered during production.

The cleanliness of functional and connecting surfaces is critical for the quality of subsequent processes like bonding, coating and printing. That’s why manufacturers may want to consider using atmospheric pressure plasma, an environmentally friendly cleaning technology suited to inline applications. Here Peter Swanson, Managing Director of adhesives specialist Intertronics, explains the benefits of plasma for industrial parts cleaning.

Sight up for the European Patent Office (EPO)'s online launch of the Office’s new study entitled ‘Patents and additive manufacturing – Trends in 3D printing technologies’.