Component Management

  Designed specifically to provide high reliability to the gold stud bump interconnects used in flip chip packaging, the 585-1 Non-Conductive Paste (NCP) has been introduced by Engineered Material Systems.

Designed to reduce insertion loss on high-speed digital designs, the Tachyon product from Isola has begun alpha testing. It is targeted at high-layer count backplanes for the growing 100Gbps market that has channel data rates in excess of 25Gbps.

At the IPC APEX Expo, March 25-27, 2014, Mandalay Bay Resort & Convention Center in Las Vegas, Essemtec will debut its new SMT production centre in booth #851. The company has claimed that this is the first combined SMT production centre which is able to jet solder paste and mount components in one machine.

Designed to enable small area electronics repair, CircuitWorks range of PCB rework, repair and prototyping materials hae been recently launched by Intertronics. The easy-to-use valved pen and syringe delivery systems enable developers, technicians, installers and servicing engineers to carry out cleaning, protection, bonding and replacement of conductive tracks to circuit boards and components.

Accommodating a wider range of production levels and budgets, Manncorp have reconfigured and expanded its selection of SMT turnkey packages. These packages include stencil printing, pick-and-place, and reflow soldering equipment.

Enabling quicker response in medical components, Morgan Advanced Material's piezoelectric composites deliver improved acoustic performance over traditional transducer materials. They also feature higher transmit and receive efficiency, and can be produced in custom sizes, shapes, and materials.

Kurtz Ersa has reported that LSI ADL Technology has purchased an Ersa VERSAFLOW 3/45 in-line selective soldering machine. The machine has the ability to have both lead and lead-free solder alloys in each soldering module, which eliminates loss of production experienced with older machines.

The LP1 absorber has been improved to deliver a more durable, damage resistant, coating to Ophir's laser sensors in the 300W to 1500W range. Designed for continuous power and long >1ms pulses, the company claims that the coating provides a damage threshold of up to 2X higher than competitive models.

A modular counter that combines high quality, flexibility and productivity has been announced by Juki. The RX-6, equipped with the LNC120 LaserAlign module, features a placement speed of up to 26,000CPH (IPC985) on a footprint of only 1.25 m, and is even more accurate and reliable than previous models. The RX-6 is extendable by the RX-7 Ultra-High-Speed Placer that reaches a maximum placement speed of 60,000CPH (IPC9850).  

Claiming to be the world’s most advanced stencil technology for solder paste printing, FCT Assembly have launched the NanoSlic Gold stencil. The stencil recieved the 2013 NPI Award for coatings/encapsulates.