Component Management

The company’s latest and highest performing dispensable thermal interface material, the Gap Filler 4000 has been announced by Bergquist. Enabling greater flexibility in dispensing and assembly processes, Bergquist claim that this delivers best-in-class thermal conductivity of 4.0W/m-K and extended working time of up to four hours.

Delivering abrasion resistance for an array of chemical and mechanical processing applications, the EP21SC-1 is a 2 component epoxy from Master Bond.

At the IPC APEX Expo, March 25-27, 2014 in Las Vegas, Nevada, Count On Tools will exhibit version 2 of the StripFeeder Modular System in Booth 725. The award-winning StripFeeder is particularly suitable for loading tape-and-reel components onto compact modules for prototyping and high-mix low-volume applications.

The first machine of its type to be installed in the country, a UV-P300 LDI laser direct imaging system from Limata has been installed at Newbury Electronics. The machine uses the latest in laser technology to produce far more technically demanding PCBs than more traditional photo lithographic techniques.

  At IPC APEX EXPO 2014, Ersa Kurtz North America will exhibit the POWERFLOW e N2 compact full tunnel wave soldering system. Relying on high-end technology, this soldering system significantly reduces solder consumption as well as the unit cost attributable to the process.

  Exhibiting at National Electronics Week ADEC Expo South Africa, Gen3 Systems and their South African distributor, Quamba Technologies, will be displaying the Gensonic stencil cleaning system. This cleaning system was named as the European Product of the Year, at productronica 2013.

Intertronics announce the Dymax light-curable optical display bonding adhesives. These one-part LCD adhesives are designed for touch panel assembly including bonding flat panel displays, LCD screens, tablets, outdoor kiosks, navigation systems, liquid crystal displays, kiosk panels, mobile phones, and smart connected devices.

Suitable for SMT, PCB packaging and microelectronics assembly applications, the Quantum Q-6800 has been announced by Nordson ASYMTEK. The high-performance, large-format dispensing system has a 423x458mm dispense area which is large enough to handle various substrate sizes and dual valve configurations.

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Altium Limited released a new range of PCB component libraries for Altium Designer supporting a wide range of Rosenberger’s board-mount connectors.