Component Management

  Kurtz Ersa's POWERFLOW N2 full nitrogen tunnel machine, designed to meet the challenges of lead-free, can reduce lead-free wave solder running costs by up to 90%. A POWERFLOW N2 machine has been purchased by Universal Electronics (UEI), to be installed at their facility.

  The Bond-Ply 800, a thermally conductive pressure-sensitive adhesive tape, which cures in ambient temperatures to allow fast and efficient assembly without the need for mechanical fasteners or high-temperature curing, has been released by Bergquist.  

A solenoid which offers double the useful stroke of a standard solenoid has been developed by Geeplus. To produce a solenoid which develops useful force over a long stroke with a flat force characteristic, the company used it’s tubular solenoid design to modify the geometry of the Super Stroke Solenoid’s pole‐piece and magnetic return path.

  Kurtz Ersa North America announces that ACME PCB Assembly has purchased an IR/PL 650 XL Rework system. Reworking large PCBs can be extremely difficult, and Ersa has responded with a large board rework machine that safely handles even the toughest applications.

Intertronics has introduced BlueWave LED Flood System, a large format lamp for UV/visible light curing, enabling larger production components to be cured with LED technology. It offers great intensity and uniformity, contributing to faster and more repeatable cure times, and with LED’s instant on/off capability there are no mechanical shutter components and no warm-up time requirements.

Aqueous Technologies has opened registration for the fourth webinar of its five-part Cleaning and Reliability Live Webinar Series. The fourth webinar, entitled “To Drain or Not to Drain – Environmental Mitigation Techniques” is scheduled to take place on Wednesday, October 22. Mike Konrad, Aqueous Technologies’ CEO will host the webinar.

KYZEN will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT) at the Renaissance Johor Bahru Hotel in Johor, Malaysia (Nov 11-13). “Understencil Wipe Cleaning Yield Improvements” was written by KYZEN’s Mike Bixenman, D.B.A., Shea Engineering’s Chrys Shea, Vicor Corporation – VI Chip Division’s Ray Whittier, and Indium Corporation’s Brook Sandy-Smith. The f...

SolderStar has developed the DeltaProbe, in response to customer demands for a new streamlined method for periodic profile capture. The SolderStar ‘Smartlink interface’ makes for an intelligent fixture which can hold Product and Process Recipe information to allow efficient profile capture, download and organisation. It provides the secondary function of a quick connection system eliminating the possibility of channel mix-up error.

With technologies constantly changing and smaller and more complex designs being developed, it poses a problem in the manufacture of quality printed circuit boards making the use of reflow oven profiling ever more important. With this in mind, SolderStar Ltd, a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, has developed the DeltaProbe, a new add-on technology ...

Suitable for use in semiconductor applications, CVD SiC and PBN materials have been introduced by Morgan Advanced Materials. The applications in which the materials are suitable for include rapid thermal processing and plasma etch process chamber components. The materials can also be used as metalorganic CVD tools for high-brightness white LED manufacturing using the indium gallium nitride process.