Component Management

The Balver Zinn Group has announced that its U.S. division, Cobar Solder Products, will highlight the Bi Rework Solder Paste (desoldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place 24th to 26th February 2015 at the San Diego Convention Center, California. The paste has been designed for desoldering Pb-free components and is ideal for LED removal.

The ZI-formed lead option allows the conversion of an axial through-hole resistor into a surface mount component without compromising the performance of the resistor. This form factor has allowed design engineers to utilise the characteristics of certain axial components, including those with UL recognition (such as the ULR wirewound series UL1412 recognised fusible resistors), in circuit design where space is a premium.

RS Components has launched into its latest distribution partnership by adding Electric Paint and the Arduino-based Touch Board from London tech creators Bare Conductive. These innovative products provide cost-effective and easy-to-use choices for professional engineers and also for maker communities.

TE Connectivity has officially opened its TE Wearables Lab in Menlo Park, California. Exclusively focused on wearable technologies across consumer, medical, industrial and defense businesses, the lab serves as a collaboration center for TE's team of engineers, scientists and its customers throughout the design process. 

A two part water, clear liquid silicone elastomer, offering outstanding moisture and temperature resistance, has been released by Intertronics. Alongside a non-yellowing catalyst system, the Opti-tec 7020 features a low viscosity which allows ease of flow around complex parts, enabling electrical insulation and shock protection. 

When Aaron PCB’s Mycronic pick and place machine had clocked in almost 50,000 manufacturing hours, the company's management team decided it was time for an upgrade. So they got in touch with Mycronic and, based on their manufacturing needs and future projections, placed an order for a MY100LXe-10.

Suitable for bonding, sealing, coating and select casting in electronic, aerospace, optical and speciality OEM applications, Master Bond's EP42HT-2LTE is a two component epoxy with a flowable paste consistency enabling precise alignment with minimal fixturing. It has a low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C and can cure at room temperature (or faster with additional heat).

Royal DSM says that independent research with Electrical Research & Development Association (ERDA), a co-operative research institution in India, shows that the use of DSM’s high performance polyamides in Moulded Case Circuit Breakers (MCCBs) makes them safer and more cost-effective to produce than traditional versions made in thermoset composites.

With the use of HDI printed circuit boards, more densely populated boards using high pin count BGAs, QFNs and LGAs, micro BGAs, and smaller and smaller devices including 10005s, it seems that assemblies should be getting smaller in size. However, in some cases printed circuit boards are getting larger, prompting Javad EMS (JEMS) to make a sizeable investment to provide large PCB capability to customers.

Metcal is pleased to introduce the MX-HPDC dual cartridge hand-piece and MX-WHPDC work-stand. Designed to meet higher thermal demands, five SMTC dual-shaft cartridge geometries are available in two temperature series.