Component Management

Mercury Systems, a specialist in trusted, secure mission-critical technologies for aerospace and defence, has announced the Rugged Data Storage (RDS) system.

Lauterbach, the global supplier of debug and trace tools, announces the addition of support for Telechips’ Dolphin+ (TCC803x) and Dolphin3 (TCC805x) SoCs as well as the VCP (TCC70xx) MCU to their TRACE32 development system.

Advantech, a provider of embedded computing solutions, is pleased to announce that its UNO series of IoT edge gateways have qualified for Amazon Web Services (AWS) Internet of Things (IoT) Greengrass, an IoT open-source edge runtime and cloud service that facilitates the development, deployment, and management of device software.

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module.

According to Fact.MR, a market research and competitive intelligence provider, the global electronic grade silicon market is valued at $3.8bn and is expected to progress at a CAGR of 5.8% through 2032.

STMicroelectronics, a global semiconductor specialist serving customers across the spectrum of electronics applications, has unveiled microcontrollers (MCUs). Targeting the coming electrified drivetrains and domain-oriented, over-the-air updateable systems that are the foundation of the next generation of EVs.

C&K, now a part of Littelfuse, a manufacturer of high-quality electromechanical switches, has extended its slide switch product family to include gold plating versions.

Advantech, a global embedded computing specialist, is pleased to announce a pair of SQFlash PCIe Gen.4 SSD solutions: the SQF 930 and SQF ER-1.

Menlo Micro, known for its Ideal Switch technology, has announced the formal qualification and production release of its MM5120 single-pole/four-throw (SP4T) DC-to-18GHz switch and MM5140 DC-to-6 GHz SP4T switch.

OMNIVISION, a global developer of semiconductors, including advanced digital imaging, analogue, and touch & display technology, have announced the three-layer stacked BSI global shutter (GS) image sensor.