3D circuit carriers optimises the use of available space

For production quantities, the circuit carriers are manufactured by injection moulding. To produce prototype quantities using an injection moulding process is much too expensive. As a cost effective alternative, Beta LAYOUT now produces 3D-MID – (Three Dimensional Mechatronic Intergrated Devices)

The PCB-POOL services specialist Beta LAYOUT produces the prototype plastic circuit carriers by 3D printing, which are then coated with a special varnish.

Using laser direct structuring (LDS), the circuit pattern structures such as the interconnections are defined; the laser also activates the pre-varnished 3D printed model which allows for the parts to be metallised. The assembly of the 3D-MID is then performed and completed in-house.

Beta LAYOUT can manufacture 3D-MID prototypes with a maximum size of 300x200x25 mm. Placement of electronic components is also possible. The minimum contact spacing is (pitch): 0.65 mm, the minimum trace width is 0.3 mm and the minimum gap between traces (pitch) is 0.3 mm.