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X-ES Introduces Rugged COM Express Module for Small Form Factor Systems

15th March 2012

X-ES

ES Admin

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Datasheet

Extreme Engineering Solutions, Inc. has introduced the company’s first ruggedized COM Express® module, the XPedite5550, which complies with the PICMG COM Express Compact form factor (95mm x 95mm) and supports an enhanced Type-5 pinout. The XPedite5550 can be hosted on a standard COM Express carrier card, hosted on a custom carrier card built to include any additional requirements from the end user, or integrated into the X-ES XPand6000 Series of Small Form Factor (SFF) rugged systems.

Designed and tested for the harshest military, aerospace, and industrial environments, the XPedite5550 includes enhancements above and beyond commercial COM Express modules to provide a rugged and reliable COTS processor mezzanine solution:

• Incorporates the same design and manufacturing principles as all X-ES Level-5 rugged products

• Designed and tested for full operation from -40 to +85ºC

• Additional mounting holes for increased structural integrity

• Extended shock and vibration capabilities for full operation in the harshest environments

• Conduction-cooled and air-cooled applications supported by single design

• Soldered down memory replaces less rugged and less reliable SO-DIMMs

• Tin-lead manufacturing process to mitigate tin-whisker effects (RoHS-compliant process is also available)

• BIT support

Targeting Freescale QorIQ™ P1011, P1020, P2010, and P2020 processors with clock speeds of up to 1.2 GHz, the XPedite5550 features up to 8 GB of DDR3-800, x2 and x1 PCI Express interfaces, three Gigabit Ethernet ports, two SATA 3.0 Gb/s ports, two serial ports, and a USB 2.0 port. BSPs for Linux, INTEGRITY, and VxWorks are available. QNX, LynxOS, and other O/S support may be available as needed.

The XPedite5550 was developed with the rugged XPand6000 SFF systems in mind. Supporting conduction cooling, natural convection cooling, and minimal SWaP, an XPand6000-based system can be bolted to almost any available surface of a small UAV or ground vehicle. Weighing as little as 3.5 lbs., XPand6000 systems provide both high-performance processing capabilities and a multitude of I/O functions added via PMCs/XMCs, including MIL-STD-1553, serial, router, and storage capability in an extremely small and lightweight package.