Communications

Extreme Engineering Solutions Introduces XPedite5530: Industry’s First 3U CompactPCI Module with Freescale Dual-Core QorIQ™ P2020 Processor

15th September 2010
ES Admin
0
Extreme Engineering Solutions (X-ES) announces the immediate availability of the XPedite5530, a conduction- or air-cooled 3U CompactPCI single board computer based on Freescale Semiconductor’s dual-core QorIQ™ P2020 processor. The XPedite5530 provides a low-power, high-performance SBC for SWaP constrained industrial, communication, and military applications.
Extreme Engineering Solutions (X-ES) announces the immediate availability of the XPedite5530, a conduction- or air-cooled 3U CompactPCI single board computer based on Freescale Semiconductor’s dual-core QorIQ™ P2020 processor. The XPedite5530 provides a low-power, high-performance SBC for SWaP constrained industrial, communication, and military applications.

The XPedite5530 feature set includes:
• Freescale P2020 processor with two 1.2-GHz PowerPC e500 cores
• Up to 4 GB of DDR3-800 ECC SDRAM
• Up to 16 GB of NAND flash and 256 MB of redundant NOR flash
• XMC/PrPMC site
• Two Gigabit Ethernet ports
• Two serial ports
• One USB port
• Operating system support
o Green Hills INTEGRITY™ Board Support Package (BSP)
o Wind River VxWorks™ BSP
o Linux BSP

The XPedite5530 is the third QorIQ P2020 processor-based board-level product from X-ES, following the air-cooled XPedite5500 and the conduction-cooled XPedite5501 XMC or PrPMC modules. To satisfy the widest range of applications, from telecommunications to military applications with MIL-STD 810F requirements, all of X-ES’s P2020 products are available in air-cooled, commercial (0 to 55ºC) to rugged, conduction-cooled (-40 to +85ºC) versions with appropriate shock and vibration testing.
The XPedite5530 is shipping today; pricing varies depending on memory configuration and ruggedization level. Volume discounts apply based on final configuration and yearly commitments.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier