SMT headers suited for connected vehicle applications
Extending its high-speed HSAutolink Connection System, Molex has announced a surface mount version of its right-angle header, offering an additional mounting option for manufacturing process optimisation. The ruggedised, industry-standard USCAR-30 header meets all USB2.0, LVDS and Ethernet BroadR-Reach electrical and EMI shielding requirements for the connected vehicle segment in automotive and commercial vehicle applications.
Laurent Stickeir, Global Product Manager, Molex, commented: “The one-piece design of the header ensures high integrity and robustness of the connector interface. While the high-temperature-rated plastic housing safeguards all the internals during lead-free, reflow soldering.”
Innovative side ribs on the housing provide assured PCB stabilisation during one-step processing, which facilitates manufacturing process efficiency further. The flexible packaging options, both rigid tray and tape and reel, support fully-automated assembly.
Several colour coded keying options are also available.
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