Fully automated production of copper wire antenna inlays

SES will use the newly installed machinery to produce ultra-thin inlays, pre-lamination sheets and dual interface products.

The equipment is laid out for high-volume production with flexible antenna layouts, high-speed coil winding, chip module handling and placement onto PVC, PET-G or polycarbonate substrates. Card formats of up to 56 positions (7 x 8) can be accommodated. The new equipment will also enable the manufacture of 200-240 µm dual-interface and inlay/pre-lamination sheets.

Production samples and a video of the equipment will be demonstrated for the first time at CARTES 2013 in the SES Booth 4H083.

Martin Scattergood, Managing Director of SES RFID Solutions, commented: "Through the use of copper wire antennas and our flexible chip module, we’re able to reduce the number of manufacturing steps. This simplifies the design from the planning stages to the finished product, and it allows us to carry out each production step in-house."

The result, Scattergood says, is achieving better quality through the reduction of error sources and a more cost-efficient production.