RS-485/RS-422 transceiver claims best-in-class ESD protection

In achieving a data rate more than double that of competing devices, the ISL3259E allows manufacturers to design the most dependable high data rate systems ever created, giving unprecedented precision control in factory automation applications or doubling the throughput in applications requiring large data transfers.

The majority of higher-end RS-485/RS-422 transceivers are limited to data rates up to 40Mbps.
Precision control of motor positioning in factory automation systems requires high speed data transfers.

In addition, the ISL3259E integrates ESD protection that is between 33% and 100% greater than the ESD ratings of other very high speed transceivers in the marketplace. This allows for the elimination of external protection components and saves on total costs. This device’s stellar ESD level is rated at 15kV air gap and 8kV contact discharge to IEC61000-4-2 on the RS-485/RS-422 bus pins and 9kV HBM on all of the other pins.

The ISL3259E has enhanced output differential voltage drive (Vod). The transceiver Vod is specified to be 40% greater then the voltage specified by the RS-485 protocol. This enhancement and rugged features make the ISL3259E an ideal fit for factory automation applications. Other applications also profit from the increased noise immunity and enhanced data integrity provided by the extra large Vod. Parallel networks, like SCSI “fast 40” systems, benefit from the 100Mbps data rate and the low transceiver and receiver skews, as well as the 4nS part-to-part skews. In addition, the receiver outputs deliver superior low state currents (typically >30mA at Vol = 1V) to ease the design of optically-coupled, isolated networks.

To round out the robust performance elements of the ISL3259E, the device also has a full fail-safe receiver, current limiting and thermal shutdown for driver overload protection, and hot plug transmitter and receiver outputs. These features protect the ISL3259E outputs and prevent data corruption when cable faults occur or when a new node is added to an active bus. This means systems will have enhanced data integrity and will be more rugged when using the ISL3259E.

In addition to these enhanced performance benefits, the ISL3259E is packaged in a small 3mm x 3mm DFN package for space-savings along with an 8 lead MSOP package option. The tiny package has a 70% smaller PCB footprint than standard 8-lead SOIC offerings and an integrated thermal slug provides approximately a 40% improvement in thermal resistance compared to the SOIC package.