NXP expands i.MX single chip module technology

This addresses applications where customers need to rapidly prototype and create their own unique product  offerings in a very limited space. The single chip system module  portfolio is a highly featured, software-enabled, plug-and-play solution in an extremely small footprint, and it’s completely designed and tested, enabling  customers to develop products within six months of sampling.

V-Link technology  allows customers to use the design acceleration that SCM provides along with the customisation capabilities of the V-link bus. Integrated within the base SCM-i.MX 6SoloX V-Link device is low-power memory and a full Power Management IC (PMIC). The SCM-i.MX 6SoloX V-Link is recommended for consumer and industrial customers building compact and low-power portable products in need of connectivity, security, sensing, and  graphical user interfaces.

Customers can realise up to 68% PCB area savings using the SCM plus V-Link technology. The SCM portfolio continues to expand with new offerings at the lower-end of the portfolio through the SCM-i.MX 6SoloX, supporting low-power memory via standard package-on-package assembly technology, at a new, lower cost offering access to samples and development boards for customers, as well as releasing the first  set of industrial parts for SCMs – the SCM-i.MX 6Dual and SCM-i.MX 6Quad. 

Continuing  to reduce the PCB area footprint, SCM devices are now also available with the option to assemble ePoP – eMMC plus LPDDR2 – on top of the base SCM device. SCM products are engineered to dramatically reduce time-to-market, allowing an estimated 25% reduction  in hardware development time – as well as greater than 50% reduction in size versus current discrete solutions. The module’s exceptional performance and connectivity allow customers targeting IoT markets to incorporate sophisticated predictive data analytics capabilities into their products, allowing for highly compelling and potentially disruptive end-products.