Communications

MX123 Sealed Connection System

4th June 2013
ES Admin
0
Molex has developed a fully-sealed, high-performance MX123 connection system that offers the smallest packaging size in the industry, designed for transportation power-train applications that accommodate low-level signal and high-current load requirements.
MX123 is a fully sealed, high-performance connection system optimized for transportation power-train applications in the most challenging under-hood environments. MX123 connection systems are currently used in on-engine automotive applications, off-road construction and industrial equipment. The MX123 system maintains low and stable contact resistance under severe temperatures and vibrations.

The system consists of lever (mate-assist) receptacles that reduce harness-assembly complexity by integrating the housing, lever, Positive Latch Reinforcement (PLR) and Connector Position Assurance (CPA) components. Sealing performance and package size are optimized by utilizing interfacial and mat-seal technologies. The mat-seal technology reduces package size and harness-assembly complexity by allowing closer center-to-center terminal spacing and by eliminating the need for crimping individual cable seals. The interfacial seal is interior to the connector shroud, protecting if from damage during harness handling. The header pins are protected from scooping by a center wall that extends longer than the terminal length. This innovative connection system is based on two terminal systems, 064- and 280-size terminals, to provide optimal electrical performance. The 064-size terminal system has increased normal force and selective precious plating required to maintain performance characteristics in the most demanding environments.

The MX123 lever receptacles mate with the MX123 vertical headers. The headers have been designed to provide customer flexibility by offering two mounting-style options, three PCB electrical strategies and multiple-plating options. The headers are designed to be vertically mounted from the top or bottom of a casting. They are available for through-hole solder processing, compliant-pin, or wire-bonding technologies with precious plating (Gold or Silver).

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