MIMO chip is the basis for HPAV2 nexwork extension kit
The technology behind D-Link's PowerLine AV2 2000 Gigabit Starter Kit for home networks is the BCM60500 HomePlug AV2 (HPAV2) MIMO chip, maker Broadcom has announced. Broadcom's powerline technology at chip level allows D-Link to deliver a significant increase in throughput and coverage performance for a variety of home connectivity devices.
D-Link's PowerLine AV2 2000 Gigabit Starter Kit is the world's first consumer home networking solution to receive AV2 MIMO certification, delivering up to two to three times faster performance. Using existing electrical wiring, the complete plug-and-play kit provides high speed networking with better coverage and higher reliability. This improved experience is achieved by using all three wires (line, neutral and ground) in a typical electrical outlet to simultaneously send more data over different paths, suitable for activities such as gaming and 4K video streaming.
Broadcom's HomePlug AV2 technology integrates physical layer features to provide an increase in throughput, noise resiliency and coverage performance, including the complete HPAV2 spectrum from 2-86MHz and more efficient notching for radio signals.
“Our plug & play PowerLine AV2 2000 Gigabit Starter Kit helps consumers create a fast and reliable home network with Gigabit speeds, delivering more reliable HDTV, streaming and online gaming experiences in the home,” said Daniel Kelley, Vice President of Marketing, D-Link Systems. “By leveraging Broadcom innovation at the chip level, we can deliver the high bandwidth connected home experience consumers desire.”
“Our HomePlug AV2 carrier-class devices enable simultaneous multi-room HDTV distribution, low-latency real-time online 3D gaming and whole-home Internet coverage,” said Greg Fischer, Broadcom Senior Vice President and General Manager, Broadband Carrier Access. “Based on our cutting-edge technology, leading integrators such as D-Link can quickly build and deploy high-performance, cost-effective solutions that combine the very latest technology and features.”