LVDS interface ICs are qualified for aerospace use

The LVDS device family is comprised of the RHFLVDS31A & RHFLVDS32A driver/receiver ICs, the RHFLVDSR2D2 LVDS dual transceiver and the RHFLVDS228A crosspoint switch. Extremely robust in the presence of heavy ions, the rad-hard devices display no significant deviation of static or dynamic features up to a total ionising dose of 300krad. The the RHFLVDS31A and RHFLVDS32A ICs operate up to 135MeV.cm²/mg SEL-free and achieve best-in-class (according to ST) SET-withstand capability. 8kV ESD protection is provided and all pins have cold-spare capability for failsafe operation.

Increasing tolerance of variations in system ground potential, simplifying design and easing grounding challenges, the LVDS interface ICs have an extremely wide input common-mode range from -4 to +5V. Shorter propagation-time and reduced channel-to-channel skew allows the devices to sustain higher data rates with better synchronisation between channels and lower power consumption, compared to other devices in the market. A superior supply-voltage absolute maximum rating of 4.8V ensures compliance with space-agency de-rating rules.

Built on proven 130nm process technology with dedicated chip architecture and layout rules, the rad-hard devices have been claimed to achieve superior radiation-immunity and electrical characteristics, compared to competing solutions. Their development was supported by the French Centre National d'Etudes Spatiales (CNES) and the European Space Agency (ESA) for use in future commercial and government satellite projects.

Jean-Francois Vadrot, Manager, Aerospace & Hi-Rel Business Unit, STMicroelectronics, commented: “Our new LVDS devices have a complete set of radiation test reports and macromodels, including end-of-life and end-of-radiation, delivering a best-in-class solution that further strengthens our offering for the worldwide Aerospace market.”