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Lanner - 3G Enabled Dual Full HD Mobile Digital Signage Computer

13th November 2009

ES Admin

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Lanner Electronics has announced the release of the LEC-7800. The LEC-7800 runs on the AMD 780E chipset and is capable of rendering dual streams of HD video from three different video out ports; HDMI, VGA and DVI-D, which means it can display on 2, Full HD LCD or Plasma screens. For connectivity purposes, it has the ability to come with an onboard SIM card socket to enable it to communicate via the 3G network.

The LEC-7800’s AMD 780E embedded chipset utilizes the power of integrated RadeonTM HD 3200 graphics with ATI AvivoTM HD technology to produce flawless HD quality playback on two screens. The 780E is AMD’s industrial grade answer to rising concerns of energy consumption. Even in full use this computer only uses only 35 – 45W, which translates directly to real-world cost savings.

There are three video out ports on the LEC-7800, HDMI, DVI-D and VGA. Our engineers have enabled the systems to utilize any two of these ports at any time. Customers are able to use both the HDMI and DVI-D ports for two separate Full HD displays, doubling their signage effectiveness.

In addition to the AMD 780E processor, the LEC-7800 can support up to 4 GB of dual channel memory and has a 2.5” hard drive bay that supports a compact flash drive or a standard HDD.

The LEC-7800 comes with 4 USB ports, 2 LAN ports, 8 lanes of DIDO and 1 serial port. With so many options of standardized connectivity this LUGE IPC promises to be easily integrated into signage systems.

For wireless capability, the LEC-7800 can be ordered with an added on-board SIM card socket for a mini-PCIe 3G / GPS module. When installed with a SIM card, the LEC-7800 can send and receive information wirelessly- making it perfect for mobile signage applications.

Lanner’s experienced electrical engineers have designed the LEC-7800 for the mobile setting. The LEC-7800 has gone through vibration, shock and temperature tests. The casing uses materials and specific design to remove heat from the core components.