Home > Products > Extreme Engineering Solutions Now Shipping XPand1300 and XPand1200

Communications

Extreme Engineering Solutions Now Shipping XPand1300 and XPand1200

6th November 2009

ES Admin

0 0

Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. Both are designed to support a minimum of ten 0.8” or 1.0” pitch slots and built in accordance with OpenVPX design principles.

XPand1200: Conduction-Cooled Development System – Featuring rapid I/O configuration via RTM modules, star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. The XPand1200 supports up to 550 W of total simultaneous power delivery and a thermal dissipation of up to 50 W per slot. Weighing 38 lbs (including backplane and power supply) and measuring 8.5” (H) x 11” (W) x 13” (L), the XPand1200 is designed to make the path from conduction-cooled development to deployment effortless.

XPand1300: Air-Cooled Development System – Featuring rapid I/O configuration via RTM modules, removable side covers for debug access, star PCIe and Gigabit Ethernet topologies, and including PCIe and Gigabit Ethernet switch. Up to 20 CFM of air-flow is provided per slot as well as 550 W of total simultaneous power delivery. The XPand1300 provides the system developer maximum performance and flexibility; weighing only 19 lbs (including backplane and power supply) and measuring 13.5” (H) x 13.5” (W) x 11.6” (L).