Communications

Easily add wireless M2M capabilities to portable devices

27th February 2014
Nat Bowers
0

Designed to make it easier than ever to add wireless capabilities to portable devices, Digi International has claimed that ConnectCore 6 is the world’s first surface mount multi-chip module with built-in wireless connectivity. Suitable for M2M applications, it provides access to all of the features of the Freescale i.MX 6 Quad, i.MX 6 Dual and i.MX 6 Solo processors.

ConnectCore6 features a small form factor and design which requires no connectors and reduces manufacturing costs. This module was developed to reduce design risk, complexity and time to market for those developing products for transportation, security and other industrial applications.

The ConnectCore 6 module’s built-in ability to connect via Wi-Fi, Bluetooth, Bluetooth Low Energy and Device Cloud by Etherios can save product designers hundreds of hours of time and expense in designing wireless devices. It especially saves time and money in terms of passing and maintaining global certifications. Complete software development tools are provided to build application software to help get products to market faster. Additionally, the module has a 5-year warranty and is designed for long-term availability, ensuring that it will be available for the lifecycle of developed products.

Joel Young, CTO and Senior Vice President, Research and Development, Digi International, commented: “The ConnectCore 6 has one of the smallest form factors on the market and it requires no connectors for assembly. The unique design, paired with pre-certified, integrated and secure wireless connectivity on the module, low power consumption and heat dissipation capabilities, make it the clear solution for M2M products. The module offers innovation for portable M2M devices in many industries, and the module will be available for the lifecycles of the products.”

ConnectCore 6 kits and prototyping modules will be available in March 2014. A fully integrated single-board computer will be available in Summer 2014.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier