Devices' occupy 70% smaller footprint than FPGAs

15th January 2014

Staff Reporter

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Datasheet

Designed to allow designers to reduce the number of gigabit serial links required for a range of end equipment, TI's pair of 10-Gbps serial link aggregator ICs are claimed to be an industry first. The TLK10081 1- to 8-channel and TLK10022 dual-channel ICs aggregate and de-aggregate point-to-point serial data streams for transmission over backplanes, copper cables and optical links.

With the aggregator ICs, designers can avoid the costly and time-consuming development of custom aggregator IP for high-performance FPGAs or ASICs. Both devices occupy a 70% smaller footprint than FPGAs and use only two power rails, compared to the five or six rails needed with FPGAs. The aggregators directly connect serial links from data converters and processors without having to re-format the data for transmission in applications like wireless infrastructure, switches, routers, video surveillance, machine vision, high-speed imaging and optical transport systems. The TLK10081 can aggregate up to eight lanes of full-duplex, 1.25-Gbps data traffic onto a single 10-Gbps link for transmission over short-distance backplanes or copper cables up to 10 meters, or long-distance optical links.

System design complexity is reduced with the class of interface IC offering multiple serial link aggregation configurations that deliver 10-Gbps maximum throughput to reduce system design complexity, implementation costs, board space and power consumption. The TLK10022 supports 4:1, 3:1 and 2:1 bidirectional serial link configurations, while the TLK10081 manages 8:1 bidirectional links. Each device supports many different data types without requiring special data encoding, and DFE and FFE extends transmission distances over copper media and optical links. The intelligent serial link switching enables programmable channel lane switching of serial links in different configurations without using external multiplexing. This innovative feature reduces system implementation time while achieving fault tolerance goals.

The TLK10081 and TLK10022 can be combined with other TI devices to create a signal chain solution: ADS42JB69 dual 16-bit, 250-MSPS ADC with JESD204B serial interface, SN65LVCP141414.2-Gbps 4-channel equalizer and SN65LVCP114 14.2-Gbps quad mux redriver. These new aggregator devices join TI’s growing portfolio of interface products that equalize, switch, re-time and aggregate high-speed serial links.

The TLK10081EVM and TLK10022EVM evaluation modules are available today for a suggested retail price of US$2,999. They are supplied with an EVM user guide and GUI software with user guide, enabling system designers to configure the device for their application. A video aggregator application note is also available, as well as IBIS-AMI and HSPICE simulation models to verify signal integrity.

The devices are available today in 13mm x 13mm, 144-ball plastic BGA packages for a suggested retail price of US$25 in 1,000-unit quantities.