Communications
New Eurotech ARM-Based Embedded Platform Enables IoT And M2M Applications
Eurotech has today revealed the launch of the CPU-301-16, an ARM-based embedded platform that extends the Eurotech family of products enabling the Internet of Things and Machine-to-Machine applications. The CPU-301-16, based on the Freescale i.MX 6 processor series, uses ARM Cortex-9 technology to pack high performance capabilities into a 67x85mm form factor.
WithA distinguishing feature of the board is that it is available as a stand-alone Single Board Computer and as a Computer on Module. When used in SBC mode, creating a system with the CPU-301-16 is as simple as adding a power supply, appropriate cables and an enclosure, since no carrier board is needed. On the other hand, when coupled to a carrier board in CoM mode, the CPU-301-16 platform exposes an even richer set of native peripherals and further capabilities.
The CPU-301-16 also supports Eurotech’s Everyware Software Framework and Everyware Device Cloud services, making it an embedded platform that is scalable, connected and easy to deploy.
“Customers pick the CPU-301-16 to implement innovative, power-efficient and feature-rich applications taking advantage of Eurotech’s proven strengths in ARM module design and optimization,” said Pierfrancesco Zuccato, Corporate Product Marketing Manager for Eurotech. “Another benefit delivered by the CPU-301-16 is the simplified porting of existing ARM devices to this next generation platform, adding performance and extending product lifecycle.”
Eurotech’s CPU-301-16 offers the following benefits:
• Flexible Deployment – CoM or SBC (with no need for carrier board)
• Multi-Core Configurations for High Performance
• Ultra Low Power Design
• HD Multimedia Playback Support
• Feature-Rich in Compact Footprint
With a very small footprint and a robust mechanical design that offers increased resilience to vibration and optional support for industrial temperature range, the CPU-301-16 meets requirements for demanding applications and simplifies the design of sealed, fanless systems.