Bluetooth Smart module boasts 4.6 x 5.6 mm footprint

Based on TDK’s proprietary SESUB technology, the device is designed with a Bluetooth IC die embedded into the thin substrate, with all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors, integrated on top. This results in the module being nearly 65% smaller than modules that employ discrete components. Its substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface, enabling designers to take full advantage of the chip’s functionality. The new module thus facilitates the hardware design process and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.

The device, due to being designed for the Bluetooth 4.0 LE specification, cuts power consumption to about one quarter of that of classic Bluetooth devices. This makes the device suitable for a wide range of wireless healthcare, sport, fitness, home entertainment and wearable devices, where minimal size, weight, and power consumption are essential.

Mass production of the SESUB-PAN-T2541 began in February 2014.