Communications

BLE ver.4.2 ICs offer enhanced security & low current consumption

8th June 2017
Barney Scott
0
Datasheets

Toshiba has announced the launch of two ICs supporting Bluetooth Low Energy (LE) ver.4.2 communications, that match industry leading low current consumption realised by previous products while offering an enhanced security function. Like previous products, the TC3567CFSG and TC3567DFSG realise a peak current consumption of 3.3mA at 3V voltage supply in transmission mode by adopting a highly efficient DC/DC converter and original low-power circuit design.

They are also able to acquire a random number with a length of up to 32 bytes, using a random number generator, newly incorporated as hardware, a function that will help to strengthen the information security of IoT products.

The TC3567CFSG incorporates of 128KB Flash ROM for storing user programs and various data in stand-alone operations, and can execute an approximately 50KB application program at maximum. As in the previous products, integration of an RF matching circuit and crystal load capacitors for a clock generator reduce the external component count during IC design, and in the minimal case only seven components are required for set development. This contributes to reductions in cost and mounting area.

The TC3567DFSG has no built-in Flash ROM and achieves extremely low current operation by reducing the current consumption required for access to Flash ROM. This allows it to achieve long operating times for applications powered by small coin batteries. For example, using a CR2032 type coin battery, the IC can carry out beacon operation for over two years.

The ICs will facilitate adoption of Bluetooth LE communications for IoT products that require a high level of security, including wearable devices for healthcare applications and high-grade small devices that use coin batteries, such as sensors and toys. They will support set makers in optimising product value.

Sample shipments are available now.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier