Communications
Eurotech's latest addition to its Intel Atom range of products is the fanless ALUDRA
Eurotech's ALUDRA is a low power, fanless single board computer ideal for applications within the Energy, Medical, Transportation and Industrial Automation industries. The ALUDRA provides all the benefits of the Intel® Atom™ architecture in a 5.25” form factor. Using the Intel N270 1.6GHz processor the ALUDRA delivers full Intel x86 compatibility with exceptional performance per watt.
Avago Technologies - First GPS Front-End Modules that Integrates an FBAR Pre-Filter with a Low Noise Amplifier
Avago Technologies has introduced the industry’s first highly integrated miniature GPS front-end modules that combine a film bulk acoustic resonator (FBAR) filter with a high-gain, low noise amplifier (LNA) that offers superior performance levels. Avago’s ALM-1912 integrates a LNA and a high-rejection pre-filter in a miniature compact package to provide a complete and compact high-performance GPS radio frequency (RF) front-end module ...
AXIOMTEK - Energy-saving Intel Pentium M 1U Network Appliance Platform with 4 Gigabyte LANs for Small to Medium Business
AXIOMTEK’s energy-saving NA-811C 19” 1U rackmount network appliance platform is configured with an ultra low power Intel processor with the Mobile Intel 915GME chipset, delivering exceptional performance with the minimum power consumption. The NA-811C supports two DDR2 SODIMM slots with 400/533 memory up to 2GB capacity.
Elan Digital releases USB-to-SDIO Host Bridge Chip
Elan Digital Systems, specialist innovators in SDIO design, announce the release of its latest connectivity device, the VUB300. This device provides a single SD/SDIO port via USB 2.0 system interface.
Energy-efficient ARM 11 module with small footprint
The new PicoMOD6 is the first ARM11-based board from F&S. Featuring a 533MHz CPU it has sufficient performance to display videos in VGA-resolution with 30fps (MPEG4/H264 decoder VGA@30fps, 2D, 3D, 5 window-layer). In addition the CPU features an integrated floating-point unit (FPU). The PicoMOD6 offers 64MB (1GB opt.) Flash and 128MB RAM and offers signals for 4x serial ports, 2x USB, I2C, SPI, I/O, Audio, CAN, Ethernet, SD-, CF-Card and touch co...
Lanner Delivers Fanless Network Appliance with Six Network Ports and Intel Atom 1.6GHz Processor
Lanner Electronics, Inc., a leading designer and ODM of advanced platforms for network applications, today revealed the general availability of the FW-7530; a fan-less economic network appliance built around an Intel 945GSE chipset and Intel Atom processor with 6 GbE ports. The FW-7530 is ideal for any low level network applications.
Lanner Announces a 3G Enabled Dual Full HD Mobile Digital Signage Computer
Lanner Electronics has announced the release of the LEC-7800. The LEC-7800 runs on the AMD 780E chipset and is capable of rendering dual streams of HD video from three different video out ports; HDMI, VGA and DVI-D, which means it can display on 2, Full HD LCD or Plasma screens. For connectivity purposes, it has the ability to come with an onboard SIM card socket to enable it to communicate via the 3G network.
VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems
VIA Technologies, Inc today announced the VIA AMOS-5000, a specially designed chassis kit for Em-ITX form factor boards such as the VIA EITX-3000, offering fast and easy assembly of a variety of fanless, robust IPC designs.
Rugged magnetostrictive transducers give absolute position measurement
The rugged construction of RDP Electronics Ltd’s MTS R Series analogue transducers make them well suited to a wide range of industrial applications which require a direct analogue output for continuous measurement of displacement and speed.
austriamicrosystems presents the worldwide first FlexRay transceiver produced in series, certified to the FlexRay specification V2.1 Rev B
austriamicrosystems has introduced the AS8221 FlexRay Standard Transceiver, which is certified to the latest FlexRay Standard V2.1 Rev B. This semiconductor device acts as the interface between digital logic and copper cable transmission, for the next generation of automotive networks.