Communications

Quectel Wireless Solutions, a global IoT solutions provider, and Rohde & Schwarz have successfully validated Quectel’s innovative 5G eCall module, part of the AG56xN series of automotive modules.

Nordic Semiconductor, a provider of low power wireless connectivity solutions, announces the expansion of its nRF91 Series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).

New short-range wireless point-to-point transceiver ICs from STMicroelectronics remove the need for cables and connectors in consumer-friendly accessories and personal electronics like digital cameras, wearables, portable hard drives, and small gaming terminals.

NEC Corporation together with Arm, Qualcomm Technologies, Red Hat, and Hewlett Packard Enterprise (HPE) have successfully demonstrated end-to-end operation of NEC's Open virtual Radio Access Network (vRAN) and 5G Core virtual User Plane Function (vUPF) products using the HPE ProLiant servers running Arm Neoverse-based CPUs and the Qualcomm X100 5G RAN Accelerator Card, with Red Hat OpenShift in conditions equivalent to a commercial environment.

Belden, a global supplier of network infrastructure and digitisation solutions, has announced the launch of its Hirschmann BXP (BOBCAT eXtreme Performance) managed switch.

The global 5G testing market is estimated at nearly $3.6 billion. The market research report hints the year-on-year growth in demand for 5G testing equipment and services is likely to be 8.2% CAGR through 2034.

In April 2024, NEC will launch a new User Plane Function (UPF) product for telecom operators that can be used to process user data traffic in 5G core networks.

Training and simulation technology in the military sector plays a decisive role for ODU connector solutions.

Firecomms, a global specialist in plastic optical fibre (POF) transceivers and fibre optic solutions, combining state-of the-art compound and silicon semiconductor technology with inventive small-scale integration, will exhibit at the 2024 IEEE Applied Power Electronics Conference (APEC) in Booth #2035 at the Long Beach Convention Centre 25–29 February 2024.

At this week’s IEEE International Solid-State Circuits Conference (IEEE ISSCC2024), imec, a global research and innovation hub in nanoelectronics and digital technologies, presents a low-power ultra-wideband (UWB) receiver chip that is ten times more resilient against interference from Wi-Fi and (beyond) 5G signals than existing, state-of-the-art UWB devices.