Updated mezzanine system offers data rates of 56Gb/s

Comprised of a vertical plug and vertical receptacle, the NeoScale High-Speed Mezzanine System features a patented modular triad wafer design that enables customisable PCB routing in high-density applications. The system’s patented Solder Charge Technology PCB attachment method delivers robust solder joints. Designers can select from 85/100Ω, power triad and low-speed signal options to build a mezzanine solution that meets their requirements. The connector design can also be blind mateable with rugged triads for multiple connectors.

Nadine Dytko-Madsen, Global Product Manager, Molex, commented: “The NeoScale High-Speed Mezzanine System uses differential pair triads with dedicated ground shields to offer exceptionally clean signal transmission compared to other mezzanine connectors. System architects and hardware engineers can count on a reliable and customisable design tool for their high-density system applications.”

The modular NeoScale triad wafer is comprised of three pins per differential pair - two signal pins and one shield pin. Each triad is a standalone, shielded, 56Gb/s capable differential pair or an 8A power feed. Triads can be optimised for signals supporting high-speed 85 or 100Ω differential pairs, high-speed single-ended transmissions, low-speed single-ended/control signals and power pins.

“The NeoScale High-Speed Mezzanine System is completely customisable so designers can populate it according to their needs,” said Dytko-Madsen. “What’s more, it can effectively replace four connectors, so it offers major PCB real estate savings.”

Other mezzanine options offer high-speed differential pairs either at 90 to 92Ω to accommodate the 85 to 100Ω range, or they offer mezzanine options with only 85 or 100Ω options. The NeoScale High-Speed Mezzanine System allows designers to run 85 and 100Ω high-speed signals through one connector. In addition, low-speed, single-ended signals (three signals per triad) and power (8A per triad) can be utilised.

The system’s honeycomb housing routes each triad to minimise crosstalk and effectively route out of the PCB in one or two layers, reducing the need for PCB real estate. In addition, unique “pillar of strength” structures in the housing protect the mating interface and flexible contacts to help prevent terminal damage.

The NeoScale High-Speed Mezzanine System is available in 12.00 to 42.00mm stack heights, circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-row configurations and 85 or 100Ω impedance to provide optimal design flexibility. Customised versions are also available, such as 10.00 and 45.00mm stack heights.