FCI Features New TwinMezz High-Density, High-Speed Mezzanine Connector System at DesignCon 2010

The TwinMezz connectors exhibit very well-matched impedance, low insertion
loss, and low crosstalk, which make them well-suited for applications in
very high-speed environments.

Configurations with six differential signal pairs per column provide maximum
signal density, delivering 25 high-speed signal pairs in a square
centimeter, or 161 signal pairs in a square inch. The innovative
hermaphroditic design mates to itself and supports stack heights ranging
from 12mm to 40mm with 200 to 800 total contacts.

The TwinMezz connector system provides exceptional flexibility with options
for integrated molded or optional metal guides and the capability to mix
signal and power wafers in a single connector. The versatile open pin field
design offers additional flexibility by allowing for mixed differential,
single-ended or power pin assignments in a single connector. TwinMezz
connectors also feature FCI's patented BGA connector termination for easy
surface-mount attachment and efficient trace routing. For more information,
visit www.fciconnect.com/twinmezz.

The TwinMezz(TM) connector system, along with other leading edge high-speed and
power products from FCI, will be displayed February 2-3 in booth #515 at the
DesignCon conference and exhibition in Santa Clara, CA. DesignVision Award
winners will be announced at the conference on February 2.