SUYIN introduces Advanced rPGA-989 Socket for Intel’s Core-i7 Processors

The new rPGA-989 sockets from the 100361FK989J200PR model series are equipped with 989 contacts arranged in a 1mm x 1mm pattern (pitch), and they receive the processor chips without application of insertion force, much as with the zero insertion force (ZIF) process. With the aid of the “CAM” locking mechanism, the components located in the socket are attached in a way that is resistant to shocks and impacts of up to 50G (under defined test conditions). The high-grade socket connections are available with flash gold plating in the contact area with up to 0.76µm of gold over 30µm of nickel. The operating temperature range extends from -40 °C to +105 °C. Its optimized dimensions of 46.98 x 39.6 x 4.60 (L x W x H in mm, overall) make this socket ideally suited for use in space-critical mobile applications. SUYIN guarantees a high degree of coplanarity for the 989 solder points, with a maximum 0.2 mm.

The rPGA-989 sockets are manufactured in a black/natural-coloured plastic (LCP) and metal composite technology, and they are shipped in tape & reel packaging with 130 pieces per reel. The plastic cover on the top permits automatic pick & place assembly using a vacuum pipette.