Molex Launches SpeedStack Connector System at DesignCon

The mated stack heights of 4.00 to 10.00mm along with a 0.80mm pitch provides design engineers with the ultimate in flexibly to address space constraints without sacrificing performance. The product will be on display at DesignCon 2013, January 28 – 31, Santa Clara, CA, booth 109.

“The marketplace has a great need for a versatile, high density, board-to-board mezzanine solution that provides space savings and high data rates, as well as optimal airflow despite a low stack height,” said Adam Stanczak, new product development manager, Molex. “The Molex SpeedStack connector system not only delivers a low-profile, high-speed solution, but it was specifically developed with a narrow housing design to allow airflow and promote system cooling.”

The SpeedStack Connector System comes in multiple circuit sizes of 22, 44, 60, 82, 104 and 120 with a range of 6 – 32 differential pairs for even greater flexibility. The 100 Ohm design provides superior impedance control with an 85 Ohm version to be released in June 2013 that will support PCIe Generation 3.0 and Intel QuickPath Interconnect requirements for next-generation I/O and memory signalling. The insert-molded wafer design includes a protective shrouded housing, providing support to the terminal location and improved electrical balance. A common ground pin helps improve electrical performance and minimize cross talk.