Cables/Connecting
Radiall Introduces New Board-to-Board RF Coaxial Interconnect Solutions
Radiall USA, Inc., is proud to introduce its new extensive range of cost effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions developed for the telecommunications industry.
RadiNew SMP-MAX large misalignment solution has a patented impedance matching insulator that is optimized for a larger operating gap between connectors making it easier for engineers to handle a maximum board-to-board distance tolerance of up to .078” (2 mm) gap without a spring, which is 300 percent more than the standard SMP. It also features a 3 degree tilt (radial travel) and it has an operating frequency range of DC-6 GHz, a 1.2 max VSWR guaranteed up to 3 GHz and it can handle up to 165 Watts of power at 3 GHz.
Radiall’s IMP-Spring, SMP-Spring and MMBX-Spring are ideal spring-loaded solutions for both increased board-to-board distance misalignment tolerances of up to .078” (2 mm) and a tilt (radial travel) of up to 4.5 degrees. In addition, these spring-loaded solutions have a consistent low VSWR, down to 1.15 at 3 GHz, and low RF leakage.