Molex Unveils EXTreme Ten60Power High-Current Connectors
Molex introduced a new version of its EXTreme Ten60Power High-Current Connectors. The EXTreme Ten60Power delivers up to 260A per linear inch, representing the highest current density available in the lowest profile interconnect on the market today.
“We have put the ultimate in Molex power and signal design into this product, which meets the market’s demand for higher wattage in smaller spaces,” says Ken Stead, manager, new product development, Molex. “The EXTreme Ten60Power blends power and signal contacts in a single low-profile connector housing to achieve the maximum current-to-space ratio.”
Featuring tighter pitch signal contacts than the original Molex 24-signal, 3-row (2.54mm x 2.54mm) version, the 25-signal, 5-row (2.00mm x 1.65mm) modules are suitable for all board-to-board and wire-to-board applications. EXTreme Ten60Power modules are available in 250 or 600 volt versions, with a range of 1 to 10 power blade modules and 6 to 36 signal modules, for a maximum of up to 60A per blade. The robust contact design accommodates AC (7.50mm power pitch spacing), DC (5.50mm) and signal. An array of module options is available, making the system highly configurable; these include three different mating lengths, end-mount, top-mount, or side-mount guide modules, voided power positions, and right-angle and vertical mount connectors for co-planar or vertical designs.
“Solving the power equation on new architectures and system platforms is a major focus for our product development teams,” adds Stead. “The modular Ten60Power system packages all the features needed for optimal design flexibility in critical space-constrained applications where power supply and signal integrity are integral to performance.”
Molex EXTreme Ten60Power connectors meet the UL 1977 current-interruption rating for hot plug applications. EXTreme Power™ products comprise EXTreme Ten60Power, EXTreme LPHPower™ and EXTreme PowerMass™ systems featuring a comprehensive selection of current densities, mechanical envelopes, mating terminations, and configurations.