Molex Unveils EdgeLine 12.5 Gbps Edge Card and CoPlanar Connectors

“As systems become more complex, greater levels of interconnectivity require boards with more layers. This leads to thicker boards, and the EdgeLine Edge Card connectors address this need by offering two versions,” Kevin O’Connor, global product development manager, Molex Incorporated, said. “Both the EdgeLine Coplanar and Edge Card connector were also formatted to meet Telcordia requirements to ensure interoperability for telecom industry standards.”

The two press-fit connectors offer a common or singulated ground to manage power and slow-speed single-ended signals in addition to high-speed differential circuits. Various standard circuit sizes are readily available along with customised pin-out solutions.

Designed for vertical insertions, the Molex EdgeLine Edge Card connectors feature a high-speed differential performance of up to 12.5 Gbps and offer a 0.80mm (.031”) terminal pitch. These connectors accommodate two board thicknesses, 1.57 and 2.36mm (.062” and .093”), with a future capability to mate to a 2.00mm (.079”), to support multiple PCB layers on complex product designs. Available in various circuit sizes (30 to 294), with or without a centre key, the EdgeLine Edge Card connectors meet MicroTCA™ requirements.

The Molex EdgeLine CoPlanar connectors, designed for right-angle insertions, accept a 1.57mm (.062”) thick PCB – plans to release a 2.36mm (.093”) version are already in the pipeline. These connectors have a terminal pitch of 0.75mm (.030”) to accept AdvancedTCA® 170-circuit standard cards; and offer enhanced airflow and thermal management with their extremely low profile of 6.00mm (.236”) above main board. Available in various circuit sizes (68, 140, 170, 226 and 250), the EdgeLine CoPlanar connectors are offered with an optional centre key.