Coiled assembly opens way to hot swap connections
A coiled assembly that enables hot swapping connections in removable media applications such as hot swapping within storage drawers has been launched by Molex. The ResilientFlex coiled assembly supports high speed signal transmission applications (such as SATA, SAS, etc.,) requiring flexible, expandable packaging for high-signal frequencies demanding tight impedance control and 12.0 Gbps data rates and beyond.
It can be implemented in both self-coiling flex circuit assembly or mechanically assisted coiling features that can extend electrical-connection lengths up to 558.80mm (22in) beyond the installed length.
The coiled assembly can be terminated with either Molex connectors, such as backplane and board-to-board connectors, or interposers— any Z-axis compression connection that has a separable interface to the flex and PCB.
Key features and benefits, include:
- A self-coiling technology design that eliminates the need for additional coiling hardware, or additional options for mechanically assisted coiling hardware customised to meet application requirements.
- Ability to connect to high-speed connectors, such as backplane and board-to-board connectors, so it supports tight impedance control and data rates of 6.0 Gbps, 12.0 Gbps, and beyond.
- A 28in overall flat, flex length that provides up to 22in (558.80mm) connection-extension lengths.
- Termination with any interposer, regardless of the number of positions or pitch, so it provides a low-profile, 0.80mm (0.031") pitch, low-loss connection.
The ResilientFlex coiled assembly is part of the line of copper flex products—also known as flexible printed circuits—which are designed to be ultra-reliable packaging technology. They are targeted for complex, small and lightweight applications, as well as harsh environments.
“From high-speed signals to power requirements, copper flex assemblies provide solutions where standard, rigid boards or cables cannot,” said Greg Kuchuris, marketing manager, Molex. “Copper flex circuit assemblies provide a consolidated approach to packaging problems, eliminating separate boards, connectors and cables. They provide a total power and signal solution in one unit at a low, total-applied cost.”