Molex extends CMC Sealed, High-Density Connection System with three new Headers

About the new 154-circuit header in compliant-pin mount and the 32- and 112-circuit solder-mount headers, Selvan Wilhelm, global product manager at Molex said: “When mating with CMC standard and power connectors, customers can achieve a cost-effective, modular, hybrid connection system for high, medium and low-current wire-to-board applications in automotive and commercial vehicles.”

Customers using Molex 154-circuit, three pocket, right-angle header with compliant-pin terminals will benefit from using a solder-free process, as opposed to conventional press-fit type mounting processes, improving productivity and reducing assembly costs. The 154-circuit header features 120 x 0.635mm (.025”) signal pins, 24 x 1.50mm (.059”) terminals and 10 x 2.80mm (.110”) power pins, supporting high currents in applications such as large ECUs. The sophisticated and robust design of the integral guiding plate on Molex 154-circuit header protects the 5 terminal rows and ensures positioning whilst withstanding high-vibration levels up to 10G. This makes the header ideal for heavy-duty applications such as those found on agricultural equipment.

The new 32-circuit, single pocket, right-angle header features solder-mount terminals and is well-suited for small powertrain applications as well as hydraulic and electronic suspension controllers. On the other hand, the 112-circuit, three pocket, right-angle header, also with solder-mount terminals, is ideally suited for any ECU application requiring a higher number of circuits. Both headers are made of hydrolytically stable, high flammability V0 plastic material, suitable for epoxy adhesion, which makes them ideal for sealed applications.